Journal of Welding and Joining

  • 제29권3호
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  • Pages.27-34
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  • 2011
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
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솔더 나노입자를 사용한 TSV Interconnection 기술

TSV Interconnection Technology Using Solder Nanoparticles

  • 이종현 (서울과학기술대학교 신소재공학과) ;
  • 윤종호 (경일대학교 기계자동차학부) ;
  • 현창용 (서울과학기술대학교 신소재공학과)
  • 발행 : 2011.06.30
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초록

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참고문헌

  1. Paul Siblerud and Bioh Kim : TSV Chip Integration, EMC-3D SE Asia Technical Symposium, www.emc3d.org, (2007)
  2. Naotaka Tanaka and Yoshihiro Yoshimira : Ultra-Thin 3D-Stacked SIP Formed Using Room-Temperature Bonding between Stacked Chips, Proc. of 55th Electronic Components and Technology Conference (2005), 788
  3. B. Swinnen, W. Ruythooren, P. De Moor, L. Bogaerts, L. Carbonell, K. De Munck, B. Eyckens, S. Stoukatch, D. Sabuncuoglu Tezcan, Z. Tokei, J. Vaes, J. Van Aelst and E. Beyne : 3D Integration by Cu-Cu Thermo-Compression Bonding of Extremely Thinned Bulk-Si Die Containing 10 ${\mu}m$ Pitch Through-Si Vias, Proc. of IDEM '06 (2006)
  4. Masaaki Oda, Nobuhiro Yuhashi, Masato Ohsawa, Shigeo Hayashi, Yoshiaki Hayashi and Kyuukou Tei : Individually Dispersed Nanoparticles Formed by Gas Evaporation Method and Their Application, Printed Electronics Asia (2007)
  5. Karlheinz Bock : The Role of Organic Electronics in Functional Hetero-System Integration, Organic Electronics Conference (2007)
  6. Chang Dong Zou, Yu Lai Gao, Bin Yang, Xin Zhi Xia, Qi Jie Zhai, Cristina Andersson and Johan Liu : Nanoparticles of the Lead-Free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression, Journal of Electronic Materials, 38-2 (2008), 351
  7. S. L. Lai, J. Y. Guo, V. Petrova, G. Ramanath and L. H. Allen : Size-Dependant Melting Properties of Small Tin Particle: Nanocalorimetric Measurements, Physical Review Letters, 77-1 (1996), 99 https://doi.org/10.1103/PhysRevLett.77.99
  8. Cristina Andersson, Changdong Zou, Bin Yang, Yulai Gao, Johan Liu and Qijie Zhai : Recent Advances in the Synthesis of Lead-Free Solder Nanoparticle, Proc. of 2nd Electronics Systemintegration Technology Conference (2008), 915
  9. Hongjin Jiang, Kyung-Sik Moon, Fry Hua and C. P. Wong : Synthesis and Thermal and Wetting Properties of Tin/Silver Alloy Nanoparticles for Low Melting Point Lead-Free Solders, Chemistry of Materials, 19-18 (2007) 4482 https://doi.org/10.1021/cm0709976
  10. C. Y. Lin, U. S. Mohanty and J. H. Chou : High Temperature Synthesis of Sn-3.5Ag-0.5Zn Alloy Nanoparticles by chemical Reduction Method, Journal of Alloys and Compound, 501 (2010), 204 https://doi.org/10.1016/j.jallcom.2010.04.111

피인용 문헌

  1. Study on Joint of Micro Solder Bump for Application of Flexible Electronics vol.31, pp.3, 2013, https://doi.org/10.5781/KWJS.2013.31.3.4