한국산학기술학회논문지 (Journal of the Korea Academia-Industrial cooperation Society)

  • 제12권3호
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  • Pages.1479-1487
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  • 2011
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  • 1975-4701(pISSN)
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  • 2288-4688(eISSN)
한국산학기술학회 (The Korea Academia-Industrial cooperation Society)
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전자부품용 에폭시 접착제의 계면 파괴 거동 연구

Interfacial Fracture Behavior of Epoxy Adhesives for Electronic Components

  • 강병언 (인하공업전문대학 화공환경과)
  • Kang, Byoung-Un (Department of Chemical and Environmental Technology, Inha Technical College)
  • 투고 : 2010.12.01
  • 심사 : 2011.03.10
  • 발행 : 2011.03.31
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초록

모바일 IT기기 등의 전자부품 분야에서 다기능, 고용량 메모리를 가능하게 하는 패키지의 중요성이 점차 증대되고 있다. 이러한 목적으로 여러개의 칩을 하나의 패키지에 실장하여 다기능, 고용량을 구현하는 Multi Chip Package(MCP)가 활용되고 있다. 이러한 MCP에서 칩과 칩간 접합 혹은 칩과 지지부재(substrate)간 접합을 구현하기위해 에폭시계 필름형 접착제가 사용되고 있다. 에폭시, 아민, 머캡탄, 아이소시아네이트 등의 유기 반응기를 가진 실란커플링제를 적용하여 에폭시계 필름형 접착제에 대한 점착성과 신뢰성을 확인하였다. 결과로부터 에폭시계 반응기를 가진 실란커플링제를 적용한 시료의 점착성과 필특성이 가장 뛰어났으며, 내습 테스트에서 계면파괴가 억제되어 가장 좋은 신뢰성을 나타내었다.

In the field of the entire electronic component industry including mobile IT products, the importance of a versatile package with the multifunctional or high capacity memories is gradually increased. Multi Chip Package which has several chips in a single package is frequently used for that purpose. In MCP, epoxy adhesive films play a major role in adhesion between the chips or between chip and substrate. A series of silane coupling agents with a functional group such as epoxy, amine, mercaptan, and isocyanate were applied to the epoxy adhesives and material properties such as wettability and reliability of the adhesives were investigated. From the results, the silane coupling agent with an epoxy functional group showed highest wettability and peel strength in epoxy adhesive. For those reasons, it lead to a superior reliability in the epoxy adhesive against interfacial fracture behaviors through moisture resistance test.

키워드

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