References
- 김진형, "반도체 패키지 기술동향", 전자정보센터, 3 월, 2007.
- 이철동, "SIP 기술동향", 전자정보센터, 9월, 2006.
- C. A. Garper, "Electronic Packaging and Interconnection Handbook", New York, McGraw-Hill, Chapter 8, 2005.
- (주)유오씨, "반도체 Package관련 기술, 기업, 특허의 최근동향", 전자정보센터, 10월, 2009.
- ATK, "ATK Technology Road Map", 2004.
- JEDEC, "Joint IPC/JEDEC Standard for Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface-Mount Devices", March, 2008.
- J. T. Huneke, R. Chu, J.-O Choi, H. Yun and H. Wu,, "Film vs. Paste: Die attach options for stacked die applications", Global SMT & Packaging, November, 2007.
- J .J. Licari and D. W. Swanson, "Adhesives Technology for Electronic Applications", New York, William Andrew Publishing, pp. 30-31, 2005.
- L. K. Teh, M. Teo, E. Anto, C. C. Wong, S. G. Mhaisalkar, P. S. Teo, and E. H. Wong, "Moisture- Induced Failures of Adhesive Flip Chip Interconnects", IEEE Trans. Compon. Packag. Technol., Vol. 28, No. 3, pp. 506-516, 2005. https://doi.org/10.1109/TCAPT.2005.848572
- M. Huang, J. Gandhi, S. Luo, and Tom Jiang, "Die-Attach Materials for High-Density Memory Stacked Die Packaging", Electronic Components and Technology Conference, pp. 1569, 2008.
- A. F. Lewis, "Epoxy Resin Adhesive. in Epoxy Resins:Chemistry and Technology", C. A. May, Ed., Marcel Dekker, NewYork, Chap.7, 1988.
- 이정화, "21세기 IT를 위한 고분자재료화학", 삼광출판사, pp. 115-119, 2001.
- M. G. Pecht, R. Agarwal, P. McCluskey, T. Dishongh, S. Javadpur and R. Mahajan, "Electronic Packaging", CRC, pp. 62-64, 1998.
- J. Park, and J. Osenbach, "Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging", Microelectronics Reliability, Vol.46, pp. 503-511, 2006. https://doi.org/10.1016/j.microrel.2005.05.010
- L. Zhai, G. Ling, J. Li, and Y. Wang, "The effect of nanoparticles on the adhesion of epoxy adhesive", Materials Letters, Elsevier, Vol. 60, pp. 3031-3033, 2006. https://doi.org/10.1016/j.matlet.2006.02.038
- R. A. Pearson and A. F. Yee, "Influence of particle size and particle size distribution on toughening mechanism in rubber-modified epoxies", J. Mater. Sci., Vol. 26, pp. 3828-3844, 1991. https://doi.org/10.1007/BF01184979
- R. A. Pearson and A. F. Yee, "Toughening mechanisms in elastomer-modified epoxies, Part3", J. Mater. Sci., Vol. 26, pp. 2571-2580, 1989.
- B. U. Kang, "Effect of the phase separation on fracture behavior of rubber-modified epoxy adhesives", J. Mater. Sci. Lett., Vol. 20, pp. 375-379, 2001. https://doi.org/10.1023/A:1006726912370
- Q. Yao, J. Qu, J. Wu, and C. P. Wong., "Characterization of Underfill/Substrate Interfacial Toughness Enhancement by Silane Additives", manuscript in preparation, 2003.
- E. P. Plueddemann, "Silane Coupling Agents", Plenum Press, New York pp. 39-45, 1982.
- E. P. Plueddemann, "Silane Coupling Agents", Plenum Press, New York pp. 75-108, 1982.
- E. P. Plueddemann, "Silane Coupling Agents", Plenum Press, New York, pp. 146-152, 1982.
- C.-T. Kuo, M.-Chuen. Yip, and K.-N. Chiang, "Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application", Microelectronics Reliability, Vol.44, pp. 627-638, 2004. https://doi.org/10.1016/j.microrel.2003.10.005
- C.-K. Chung and K.-O. Paik, "Nonconductive Films(NCFs) with Multifunctional Epoxies and Silica Fillers for Reliable NCFs Flip Chip on Organic Boards(FCOBs)", IEEE Trans. Electron. Packag. Manufact., Vol. 32, No. 2, pp 65-73, 2009. https://doi.org/10.1109/TEPM.2009.2015287
- P. L. Teh, M. Jaafar, H. M. Akil, K. N. Seetharamu, A. N. R. Wagiman and K. S. B도, "Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application", Polym. Adv. Technol., John Wiley and Sons, Ltd., Vol. 19, pp. 308-315, 2008. https://doi.org/10.1002/pat.1014
- 이충희, 이효연, 김형일, 유종민, 김경만, "Bonding & Debonding 고분자 접착소재 및 다이스택용 접착 제 특성 평가", 한국정밀공학회 춘계논문집, pp.653-654. 2010.