The Proceeding of the Korean Institute of Electromagnetic Engineering and Science (한국전자파학회지:전자파기술)

The Korean Institute of Electromagnetic Engineering and Science (한국전자파학회)
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EMI/EMC of 3D IC(Integrated Circuit)

  • Published : 2011.01.30
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Abstract

Keywords

References

  1. "3DIC & TSV Report", Yole Development, Nov 2007.
  2. Jun So Pak, Jonghyun Cho, Joohee Kim, Junho Lee, Hyungdong Lee, Kunwoo Park, and Joungho Kim, "Slow wave and dielectric quasi-tern modes of metal-insulator-semiconductor structure through silicon via in signal propagation and power delivery in 3D chip package", in Proceedings of the 60th Electronic Componentsand Technology Conference 2010(ECTC2010), Jun. 2010.
  3. Jun So Pak, Jonghyun Cho, Joohee Kim, Junho Lee, Hyungdong Lee, Kunwoo Park, and Joungho Kim, "On-chip PDN design effects on 3D stacked on-chip PDN impedance based on TSV interconnection", in Proceedings of the 2010 Electrical Design Advanced Packaging & Systems, Singapore, Dec. 2010.