Journal of Welding and Joining

  • 제29권1호
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  • Pages.52-58
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  • 2011
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
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금속(Au)범프의 횡초음파 접합 조건 연구

Study of Metal(Au) Bump for Transverse Ultrasonic Bonding

  • 지명구 (서울과학기술대학교 NID융합기술대학원) ;
  • 송춘삼 (서울과학기술대학교 산업기술정책연구소) ;
  • 김주현 (국민대학교 기계시스템공학부) ;
  • 김종형 (서울과학기술대학교 기계설계.자동화공학부)
  • Ji, Myeong-Gu (Seoul National University of Science and Technology, School of NID Fusion Nano Micro Robot System) ;
  • Song, Chun-Sam (Seoul National University of Science and Technology, Institute for Industrial Technology Policy(INTEP)) ;
  • Kim, Joo-Hyun (Kookmin university, school of mechanical engineering) ;
  • Kim, Jong-Hyeong (Seoul National University of Science and Technology, School of Mechanical Design and Automation Engineering)
  • 투고 : 2010.10.28
  • 심사 : 2011.01.25
  • 발행 : 2011.02.28
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초록

In this paper, the direct bonding process between FPCB and HPCB was studied. By using an ultrasonic horn which is mounted on the ultrasonic bonding machine, it is alternatively possible to bond the gold pads attached on the FPCB and HPCB at room temperature without an adhesive like ACA or NCA. The process condition for obtaining more bonding strength than 0.6 Kgf, which is commercially required, was carried out as 40 kHz of frequency, 0.6 MPa of bonding pressure and 2 second of bonding time. The peel off test was performed for evaluating bonding strength which results in more than 0.8 Kgf.

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참고문헌

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