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Warpage Study of Ultra Thin Package Used in Mobile Devices

모바일 기기에 적용되는 초박형 패키지의 휨 현상

  • 송차규 (서울과학기술대학교 NID융합기술대학) ;
  • 김경호 (서울과학기술대학교 NID융합기술대학) ;
  • 좌성훈 (서울과학기술대학교 NID융합기술대학원)
  • Published : 2011.02.28

Abstract

Keywords

References

  1. W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst, F. Su, K. S. Chian and S. Yi : Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry, Proc. EuroSimE, 2002, 362
  2. T. Y. Wu, Y. Tsukad and W. T. Chen: Materials and mechanics issues in flip-chip organic packaging, Proc. 46th Electronic Components and Technology Conference (ECTC), 1996, 524
  3. G. Kelly, C. Lyden, W. Lawton, J. Barrett, A. Saboui, H. Pape and H. Peters:The Importance of Molding Compound Chemical Shrinkage in the Stress and Warpage Analysis of PQFPs, Proc. 45th Electronic Components and Technology Conference (ECTC), 1995, 977
  4. B. Kiang, J. Wittmershaus, R. Kar and N. Sugai : Package Warpage Evaluation for Multi-Layer Molded PQFP, Proc. 11th IEEE/CHMT International Electronics1991 on Manufacturing Technology Symposium (IEMT), , 89
  5. L. Yip and A. Hamzehdoost: Package Warpage Evaluation for High Performance PQFP, Proc. 45th Electronic Components and Technology Conference (ECTC), 1995, 229
  6. K. Irving, Y. Chien, J. Zhang, L. Rector and M. Todd: Low Warpage Molding Compound Development for Array Packages, Proc. 1st Electronics System integration Technology Conference (ESTC), 2006, 1001
  7. T. Jin, N. S. Goo, S. Woo, H. C. Park: Use of a Digital Image Correlation Technique for Measuring the Material Properties of Beetle Wing, Journal of Bionic Engineering 6 (2009) 224-231 https://doi.org/10.1016/S1672-6529(08)60105-5