References
- Computed tomography details casting defects, Advanced Materials & Process, Nov 1990, 54-66
- M. Rooks, B. Benhabib, and K. C. Smith: Development of an inspection process for ball-grid-array technology using scanned beam x-ray laminography, IEEE trans. On Components, Packing, and Manufacturing Technology. Part A. 18-4 (December 1995), 851-861 https://doi.org/10.1109/95.477473
- Y. J. Roh, K. W. Ko, H. S. Cho, H. C. Kim, H. N. Joo : Inspection of BGA(Ball Grid Array) solder joints using x-ray cross-sectional images, Intelligent Systems and Advanced Manufacturing(SPIE), Vol. 3836 (1999), 168-178
- 노영준 : 디지털 영상 합성법을 사용한 X 선 단층 영상 시스 템의 해석 및 설계, 한국과학기술원, 1997, 8-9
- S. Rooks, T. Sack : X-ray inspection of flip chip attach usisng digital tomosynthesis, Circuit World, 21-3, 51-55, 1995
- S. T. Kang, Y. U. Kim and H. S. Cho : A digital tomosynthesis method for evaluating the soldering states of ball-grid-array joints, 7th Annual Research Symposium of Transfer of Emerging N DE Technologies, 1998
- Heikkila, J and Silven, O : A four-step camera calibration procedure with implicit image correction, IEEEcomputer society, 1106 -1112, June 1997
- David vernon : Machine vision- Automated visual inspection and robot vision, prentice