References

1. W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst, F. Su, K. S. Chian and S. Yi : Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry, Proc. EuroSimE, 2002, 362
2. T. Y. Wu, Y. Tsukad and W. T. Chen: Materials and mechanics issues in flip-chip organic packaging, Proc. 46th Electronic Components and Technology Conference (ECTC), 1996, 524
3. G. Kelly, C. Lyden, W. Lawton, J. Barrett, A. Saboui, H. Pape and H. Peters:The Importance of Molding Compound Chemical Shrinkage in the Stress and Warpage Analysis of PQFPs, Proc. 45th Electronic Components and Technology Conference (ECTC), 1995, 977
4. B. Kiang, J. Wittmershaus, R. Kar and N. Sugai : Package Warpage Evaluation for Multi-Layer Molded PQFP, Proc. 11th IEEE/CHMT International Electronics1991 on Manufacturing Technology Symposium (IEMT), , 89
5. L. Yip and A. Hamzehdoost: Package Warpage Evaluation for High Performance PQFP, Proc. 45th Electronic Components and Technology Conference (ECTC), 1995, 229
6. K. Irving, Y. Chien, J. Zhang, L. Rector and M. Todd: Low Warpage Molding Compound Development for Array Packages, Proc. 1st Electronics System integration Technology Conference (ESTC), 2006, 1001
7. T. Jin, N. S. Goo, S. Woo, H. C. Park: Use of a Digital Image Correlation Technique for Measuring the Material Properties of Beetle Wing, Journal of Bionic Engineering 6 (2009) 224-231 https://doi.org/10.1016/S1672-6529(08)60105-5