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ACF COB Bonding Process using Thermosonic

열초음파를 이용한 ACF COB(Chip-on-Board)접합 프로세스

  • 송용 (중앙대학교 기계공학부) ;
  • 임병승 (중앙대학교 기계공학부) ;
  • 정진식 (중앙대학교 기계공학부) ;
  • 김종민 (중앙대학교 기계공학부)
  • Published : 2011.02.28

Abstract

Keywords

References

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  2. M.C. Choi, Y.K. Kim and C.S. Ha. "Polymers for Flexible Displays: From Material Selection to Device Applications", Progress in Polymer Science, 33, 581- 630, 2008 https://doi.org/10.1016/j.progpolymsci.2007.11.004
  3. C.L. Chuang, Q.A. Liao, H.T. Li, S.J. Liao and G.S. Huang. "Increasing the Bonding Strength of Chip on Flex Substrates using Thermosonic Flip-chip Bonding Process with Nonconductive Paste", Microelectronic Engineering, 87, 624-630, 2010 https://doi.org/10.1016/j.mee.2009.08.027