분자동역학 시뮬레이션을 이용한 나노스케일 표면 절삭에 관한 연구

A Study on Nanoscale Surface Polishing using Molecular Dynamics Simulations

  • 강정원 (충주대학교 컴퓨터공학과) ;
  • 최영규 (충주대학교 컴퓨터공학과)
  • Kang, Jeong-Won (Department of Computer Engineering, Chungju National University) ;
  • Choi, Young-Gyu (Department of Computer Engineering, Chungju National University)
  • 투고 : 2011.08.22
  • 심사 : 2011.09.15
  • 발행 : 2011.09.30

초록

This paper shows the results of classical molecular dynamics modeling for the interaction between spherical nano abrasive and substrate in chemical mechanical polishing processes. Atomistic modeling was achieved from 3-dimensional molecular dynamics simulations using the Morse potential functions for chemical mechanical polishing. The abrasive dynamics was modeled by three cases, such as slipping, rolling, and rotating. Simulation results showed that the different dynamics of the abrasive results the different features of surfaces. The simulation concerning polishing pad, abrasive particles and the substrate has same results.

키워드

참고문헌

  1. R. K. Singh and R. Bajaj, "Advances in chemical mechanical planarization", MRS Bulletin, Vol. 27, No. 10, p. 743, 2002. https://doi.org/10.1557/mrs2002.244
  2. R. K. Singh, S.-M. Lee, K.-S. Choi, G. B. Basim, W. Choi, Z. Chen, and B. M. Moudgil, "Fundamentals of slurry design for CMP of metal and dielectric materials", MRS Bulletin, Vol. 27, No. 10, p. 752, 2002. https://doi.org/10.1557/mrs2002.245
  3. R. Bajaj, A. Zutshi, R. Surana, M. Naik, and T. Pan, "Integration challengers for CMP of copper", MRS Bulletin, Vol. 27, No. 10, p. 776, 2002. https://doi.org/10.1557/mrs2002.249
  4. D. Evans, "The future of CMP", MRS Bulletin, Vol. 27, No. 10, p. 779, 2002. https://doi.org/10.1557/mrs2002.250
  5. 이경진, 김상용, 서용진, "반경험적인 실험설계 기법을 이용한 CMP 공정 변수의 최적화", 전기전자재료학회논문지, 15권, 11호 p. 932, 2002.
  6. 김철복, 김상용, 서용진, "기계화학적 연마를 이용한 트렌치 구조의 산화막 평탄화", 전기전자재료학회논문지, 15권, 10호 p. 832, 2002.
  7. 박창준, 김상용, 서용진, "실리카 슬러리의 희석과 연마제의 첨가가 CMP 특성에 미치는 영향", 전기전자재료학회논문지, 15권, 10호 p. 844, 2002.
  8. Y. Ye, R. Biswas, A. Bastawros, and A. Chandra, "Simulation of chemical mechanical planarization of copper with molecular dynamics", Appl. Phys. Lett., Vol. 81, No. 10, p. 1875, 2002. https://doi.org/10.1063/1.1505113
  9. Y. Ye, R. Biswas, J. R. Morris, A. Bastawros, and A. Chandra, "Molecular dynamics simulation of nanoscale machining of copper", Nanotechnology, Vol. 14, No. 3, p. 390, 2003. https://doi.org/10.1088/0957-4484/14/3/307
  10. M. P. Allen and D. J. Tildesley, "Computer Simulation of Liquids", Oxford, Clarendon, p. 71, 1987.