A Study on Nanoscale Surface Polishing using Molecular Dynamics Simulations

분자동역학 시뮬레이션을 이용한 나노스케일 표면 절삭에 관한 연구

  • Kang, Jeong-Won (Department of Computer Engineering, Chungju National University) ;
  • Choi, Young-Gyu (Department of Computer Engineering, Chungju National University)
  • 강정원 (충주대학교 컴퓨터공학과) ;
  • 최영규 (충주대학교 컴퓨터공학과)
  • Received : 2011.08.22
  • Accepted : 2011.09.15
  • Published : 2011.09.30

Abstract

This paper shows the results of classical molecular dynamics modeling for the interaction between spherical nano abrasive and substrate in chemical mechanical polishing processes. Atomistic modeling was achieved from 3-dimensional molecular dynamics simulations using the Morse potential functions for chemical mechanical polishing. The abrasive dynamics was modeled by three cases, such as slipping, rolling, and rotating. Simulation results showed that the different dynamics of the abrasive results the different features of surfaces. The simulation concerning polishing pad, abrasive particles and the substrate has same results.

Keywords

References

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