JSTS:Journal of Semiconductor Technology and Science

The Institute of Electronics and Information Engineers (대한전자공학회)
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A Triple-Band Transceiver Module for 2.3/2.5/3.5 GHz Mobile WiMAX Applications

  • Jang, Yeon-Su (ISRC(Inter-university Semiconductor Research Center), Electrical Engineering and Computer Science, Seoul National University) ;
  • Kang, Sung-Chan (ISRC(Inter-university Semiconductor Research Center), Electrical Engineering and Computer Science, Seoul National University) ;
  • Kim, Young-Eil (Samsung Electronics Co., LTD.) ;
  • Lee, Jong-Ryul (Future Communication IC Inc.) ;
  • Yi, Jae-Hoon (Yu Jeong System Co., LTD.) ;
  • Chun, Kuk-Jin (ISRC(Inter-university Semiconductor Research Center), Electrical Engineering and Computer Science, Seoul National University)
  • Received : 2011.05.11
  • Published : 2011.12.31
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Abstract

A triple-band transceiver module for 2.3/2.5/3.5 GHz mobile WiMAX, IEEE 802.16e, applications is introduced. The suggested transceiver module consists of RFIC, reconfigurable/multi-resonance MIMO antenna, embedded PCB, mobile WiMAX base band, memory and channel selection front-end module. The RFIC is fabricated in $0.13{\mu}m$ RF CMOS process and has 3.5 dB noise figure(NF) of receiver and 1 dBm maximum power of transmitter with 68-pin QFN package, $8{\times}8\;mm^2$ area. The area reduction of transceiver module is achieved by using embedded PCB which decreases area by 9% of the area of transceiver module with normal PCB. The developed triple-band mobile WiMAX transceiver module is tested by performing radio conformance test(RCT) and measuring carrier to interference plus noise ratio (CINR) and received signal strength indication (RSSI) in each 2.3/2.5/3.5 GHz frequency.

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References

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