마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제17권2호
  • /
  • Pages.29-33
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  • 2010
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
권호 표지

Development of Wafer Bond Integrity Inspection System Based on Laser Transmittance

  • Jang, Dong-Young (Departemant of Industrial and Information Systems Engineering, Seoul National University of Technology) ;
  • Ahn, Hyo-Sok (Graduate School of NID Fusion Technology, Seoul National University of Technology) ;
  • Mehdi, Sajadieh.S.M. (Seoul TechnoPark) ;
  • Lim, Young-Hwan (Seoul TechnoPark) ;
  • Hong, Seok-Kee (Seoul TechnoPark)
  • 투고 : 2010.03.15
  • 심사 : 2010.06.11
  • 발행 : 2010.06.30
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초록

Among several critical topics in semiconductor fabrication technology, particles in addition to bonded surface contaminations are issues of great concerns. This study reports the development of a system which inspects wafer bond integrity by analyzing laser beam transmittance deviations and the variations of the intensity caused by the defect thickness. Since the speckling phenomenon exists inherently as long as the laser is used as an optical source and it degrades the inspection accuracy, speckle contrast is another obstacle to be conquered in this system. Consequently speckle contrast reduction methods were reviewed and among the all remedies have been established in the past 30 years the most adaptable solution for inline inspection system is applied. Simulation and subsequently design of experiments has been utilized to discover the best solution to improve irradiance distribution and detection accuracy. Comparison between simulation and experimental results has been done and it confirms an outstanding detection accuracy achievement. Bonded wafer inspection system has been developed and it is ready to be implemented in FAB in the near future.

키워드

참고문헌

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