Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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A Study on the Bonding Performance of COG Bonding Process

COG 본딩의 접합 특성에 관한 연구

  • Choi, Young-Jae (Digital Collaboration Center, Korea Institute of Industrial Technology) ;
  • Nam, Sung-Ho (Manufacturing Convergence R&D Department, Korea Institute of Industrial Technology) ;
  • Kim, Kyeong-Tae (Manufacturing System R&D Department, Korea Institute of Industrial Technology) ;
  • Yang, Keun-Hyuk (LG Display Co., Ltd) ;
  • Lee, Seok-Woo (Manufacturing System R&D Department, Korea Institute of Industrial Technology)
  • 최영재 (한국생산기술연구원 디지털협업센타) ;
  • 남성호 (한국생산기술연구원 융합생산기술연구부) ;
  • 김경태 (한국생산기술연구원 생산시스템연구부) ;
  • 양근혁 (LG 디스플레이(주)) ;
  • 이석우 (한국생산기술연구원 생산시스템연구부)
  • Received : 2010.05.03
  • Accepted : 2010.06.01
  • Published : 2010.07.01
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Abstract

In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.

Keywords

References

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