Journal of Adhesion and Interface (접착 및 계면)

The Society of Adhesion and Interface, Korea (한국접착및계면학회)
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Adhesion Performance of UV-curable Debonding Acrylic PSAs with Different Thickness in Thin Si-wafer Manufacture Process

박막 실리콘 웨이퍼용 UV 경화형 Debonding 아크릴 점착제의 두께별 접착 물성

  • Lee, Seung-Woo (Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University) ;
  • Park, Ji-Won (Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University) ;
  • Lee, Suk-Ho (Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University) ;
  • Lee, Yong-Ju (Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University) ;
  • Bae, Kyung-Rul (Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University) ;
  • Kim, Hyun-Joong (Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University) ;
  • Kim, Kyoung-Mahn (Energy Materials Research Center, Korea Research Institute of Chemical Technology) ;
  • Kim, Hyung-Il (College of Engineering Chungnam National University) ;
  • Ryu, Jong-Min (College of Engineering Chungnam National University)
  • 이승우 (서울대학교 환경재료과학전공 바이오복합재료 및 접착과학 연구실, 농업생명과학연구원) ;
  • 박지원 (서울대학교 환경재료과학전공 바이오복합재료 및 접착과학 연구실, 농업생명과학연구원) ;
  • 이석호 (서울대학교 환경재료과학전공 바이오복합재료 및 접착과학 연구실, 농업생명과학연구원) ;
  • 이용주 (서울대학교 환경재료과학전공 바이오복합재료 및 접착과학 연구실, 농업생명과학연구원) ;
  • 배경렬 (서울대학교 환경재료과학전공 바이오복합재료 및 접착과학 연구실, 농업생명과학연구원) ;
  • 김현중 (서울대학교 환경재료과학전공 바이오복합재료 및 접착과학 연구실, 농업생명과학연구원) ;
  • 김경만 (한국 화학연구원 에너지소재연구센터) ;
  • 김형일 (충남대학교 공업화학과, 유기재료 응용화학연구실) ;
  • 유종민 (충남대학교 공업화학과, 유기재료 응용화학연구실)
  • Received : 2010.07.22
  • Accepted : 2010.09.17
  • Published : 2010.09.30
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Abstract

UV-curable acrylic Pressure-sensitive adhesives (Acrylic PSAs) are used in many different parts in the world. A wafer manufacture process which is based on semiconductor industry is one thing. We have used acrylic PSAs whose thickness is different from $20{\mu}m$ to $30{\mu}m$ in wafer manufacture process so far. But as wafers become more thinner, acrylic PSAs are supposed to satisfy the requirements such as proper adhesion performance. The main purpose of this research is studying proper adhesion performance and UV-curing behavior of UV-curable acrylic PSAs with very thin thickness and then determining optimized conditions to raise the efficiency of thin wafer production. Acrylic PSAs contain 2-Ethylhexyl Acrylate (2-EHA), Acrylic Acid (AA) and Butyl Acrylate (BA). Ethyl acetate (EtAc) is used as solvent. The acrylic PSAs are obtained using solvent polymerization. Thickness of UV-curable acrylic PSAs is different from $10{\sim}30{\mu}m$. By peel strength and probe tack, adhesion performance and UV curing behavior of acrylic PSA are concerned.

Keywords

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