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Adhesion Performance of UV-curable Debonding Acrylic PSAs with Different Thickness in Thin Si-wafer Manufacture Process  

Lee, Seung-Woo (Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University)
Park, Ji-Won (Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University)
Lee, Suk-Ho (Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University)
Lee, Yong-Ju (Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University)
Bae, Kyung-Rul (Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University)
Kim, Hyun-Joong (Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Science, Seoul National University)
Kim, Kyoung-Mahn (Energy Materials Research Center, Korea Research Institute of Chemical Technology)
Kim, Hyung-Il (College of Engineering Chungnam National University)
Ryu, Jong-Min (College of Engineering Chungnam National University)
Publication Information
Journal of Adhesion and Interface / v.11, no.3, 2010 , pp. 120-125 More about this Journal
Abstract
UV-curable acrylic Pressure-sensitive adhesives (Acrylic PSAs) are used in many different parts in the world. A wafer manufacture process which is based on semiconductor industry is one thing. We have used acrylic PSAs whose thickness is different from $20{\mu}m$ to $30{\mu}m$ in wafer manufacture process so far. But as wafers become more thinner, acrylic PSAs are supposed to satisfy the requirements such as proper adhesion performance. The main purpose of this research is studying proper adhesion performance and UV-curing behavior of UV-curable acrylic PSAs with very thin thickness and then determining optimized conditions to raise the efficiency of thin wafer production. Acrylic PSAs contain 2-Ethylhexyl Acrylate (2-EHA), Acrylic Acid (AA) and Butyl Acrylate (BA). Ethyl acetate (EtAc) is used as solvent. The acrylic PSAs are obtained using solvent polymerization. Thickness of UV-curable acrylic PSAs is different from $10{\sim}30{\mu}m$. By peel strength and probe tack, adhesion performance and UV curing behavior of acrylic PSA are concerned.
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