Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Study on Fabrication of 3-Dimensional Stacked Chip Package with Anisotropic Conductive Film

ACF를 이용한 3차원 패키지의 제조 공정에 대한 연구

  • 이영철 (성균관대학교 신소재공학과) ;
  • 김종웅 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 산업단) ;
  • 김광석 (성균관대학교 신소재공학과) ;
  • 유정희 (한국전자통신연구원 및 신뢰성 연구) ;
  • 정승부 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 산업단)
  • Published : 2009.06.30
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References

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