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http://dx.doi.org/10.5781/KWJS.2009.27.3.032

Study on Fabrication of 3-Dimensional Stacked Chip Package with Anisotropic Conductive Film  

Lee, Young-Chul (성균관대학교 신소재공학과)
Kim, Jong-Woong (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 산업단)
Kim, Kwang-Seok (성균관대학교 신소재공학과)
Yu, Chong-Hee (한국전자통신연구원 및 신뢰성 연구)
Jung, Seung-Boo (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 산업단)
Publication Information
Journal of Welding and Joining / v.27, no.3, 2009 , pp. 32-37 More about this Journal
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Times Cited By KSCI : 2  (Citation Analysis)
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