Study on Fabrication of 3-Dimensional Stacked Chip Package with Anisotropic Conductive Film
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Lee, Young-Chul
(성균관대학교 신소재공학과)
Kim, Jong-Woong (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 산업단) Kim, Kwang-Seok (성균관대학교 신소재공학과) Yu, Chong-Hee (한국전자통신연구원 및 신뢰성 연구) Jung, Seung-Boo (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 산업단) |
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