전기학회논문지P (The Transactions of the Korean Institute of Electrical Engineers P)

  • 제58권1호
  • /
  • Pages.67-71
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  • 2009
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  • 1229-800X(pISSN)
  • /
  • 2586-7792(eISSN)
대한전기학회 (The Korean Institute of Electrical Engineers)
권호 표지

조립과 확장이 가능한 반도체 제조용 기판 가열 장치

An Assemble and Expandable Substrate Heating Apparatus for the Semiconductor Manufacturing

  • 정순원 (ETRI 융합부품.소재연구부문) ;
  • 구경완 (호서대학교 국방과학기술학과)
  • 발행 : 2009.03.01
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초록

This research is a new structure of the semiconductor substrate heating apparatus in which the assembly and expansion are possible. The fast thermo-responsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. There is no problem with the deformation interpreted in the state where it assembles the block of a several of the simulation result structure, the safety, and the stress. In addition, it is confirmed that building a large-size heating block is possible since the temperature deflection of the manufactured plate is lower than the standard value.

키워드

참고문헌

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