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Composite EBG Power Plane Using Magnetic Materials for SSN Suppression in High-Speed Digital Circuits

고속 디지털 회로의 SSN 억제를 위한 자성 재료가 적용된 복합형 EBG 전원면

  • Eom, Dong-Sik (Department of Electronics Engineering, Ajou University) ;
  • Kim, Dong-Yeop (Department of Electronics Engineering, Ajou University) ;
  • Byun, Jin-Do (Department of Electronics Engineering, Ajou University) ;
  • Lee, Hai-Young (Department of Electronics Engineering, Ajou University)
  • Published : 2008.08.31

Abstract

In this paper, a new composite electromagnetic bandgap(EBG) structure using magnetic materials is proposed for simultaneous switching noise(SSN) suppression in the high-speed digital circuits. The proposed EBG structure has periodic unit cells of square-patches connected by spiral-shaped bridges. The magnetic materials are located on the unit cells of spiral-shaped EBG. The real part of the permeability shifts bandgap to the lower frequency region due to the increased effective inductance. The imaginary part of the permeability has magnetic loss that decreases parasitic LC resonance peaks from between the unit cells. As a result, the proposed structure has the lower cut-off frequency compared with conventional EBG structure and -30 dB SSN suppression bandwidth from 175 MHz to 7.7 GHz. The proposed structure is expected to improve the power integrity and reduce the size of the EBG power plane.

본 논문에서는 고속 디지털 회로에서 발생하는 SSN(Simultaneous Switching Noise)을 억제하기 위한 자성 재료가 적용된 복합형 EBG(Electromagnetic Bandgap) 구조의 전원면을 제안하였다. 제안된 EBG 구조는 정사각형 패치와 나선형 선로로 구성된 단위 셀이 주기적으로 연결되어 있으며, 자성 재료는 EBG 구조의 단위 셀 위에 국부적으로 적용되었다. 자성 재료의 투자율 실수 성분은 EBG 단위 셀 사이의 유효 인덕턴스를 중가시켜 밴드갭을 낮은 주파수로 이동시키고, 자성 손실 특성을 갖는 허수 성분은 단위 셀 사이에서 야기되는 기생 LC 공진의 피크값을 낮춘다. 그 결과 제안된 구조는 기존 EBG 구조에 비해 낮은 차단 주파수 특성을 가지며, -30 dB 저지 대역을 기준으로 175 MHz에서 7.7 GHz까지 넓은 억제 대역폭을 나타냈다. 제안된 구조는 전원 무결성 개선 및 EBG 전원면 소형화에 크게 기여할 것으로 기대된다.

Keywords

References

  1. T. Kamgaing, O. M. Ramahi 'A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface', IEEE Microw. Compon. Lett., vol. 13, no. 1, pp. 21-23, Jan. 2003 https://doi.org/10.1109/LMWC.2002.807713
  2. R. Abhari, G. V. Eleftheriades, 'Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high speed circuits', IEEE Trans. Microw. Theory Tech., vol. 51, no. 6, pp. 1629-1639, Jun. 2003 https://doi.org/10.1109/TMTT.2003.812555
  3. V. Ricchiuti, 'Power-supply decoupling on fully populated high-speed digital PCBs', IEEE Trans. Electromagn. Compat., vol. 43, no. 4, pp. 671-676, Nov. 2001 https://doi.org/10.1109/15.974649
  4. M. Xu, T. H. Hubing J. Chen, T. P. Van Doren, J. L. Drewniak, and R. E. DuBroff, 'Power-bus decoupling with embedded capacitance in printed circuit board design', IEEE Trans. Electromagn. Compat., vol. 45, no. 1, pp. 22-30, Feb. 2003 https://doi.org/10.1109/TEMC.2002.808075
  5. T. L. Wu, C. C. Wang, Y. H. Lin, T. K. Wang, and G. Chang, 'A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures', IEEE Microw. Wireless Compon. Lett., vol. 14, no. 7, pp. 337-339, Jul. 2004 https://doi.org/10.1109/LMWC.2004.829275
  6. T. L. Wu, Y. H. Lin, T. K. Wang, C. C. Wang, and S. T. Chen, 'Electromagnetic bandgap power/gound planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits', IEEE Microw. Theory Tech., vol. 53, no. 9, Sep. 2005
  7. Y. Toyota, K. Iokibe, R. Koga, A. E. Engin, T. H. Kim, and M. Swaminathan, 'Miniaturization of electromagnetic bandgap structures with high-permeability magnetic metal sheet', IEEE Int. Symp. Electromagn. Compat., Jul. 2007
  8. T. L. Wu, C. C. Wang, Y. H. Lin, T. K. Wang, and G. Chang, 'A novel power plane with super wideband elimination of ground bounce noise on high speed circuits', IEEE Microw. Wireless Compon. Lett., vol. 15, no. 3, pp. 174-176, Mar. 2005 https://doi.org/10.1109/LMWC.2005.844216
  9. S. H. Joo, D. Y. Kim, and H. Y. Lee 'A S-bridged inductive electromagnetic bandgap power plane for suppression of ground bounce noise', IEEE Microw. Wireless Compon. Lett., vol. 17, no. 10, pp. 709- 711, Oct. 2007 https://doi.org/10.1109/LMWC.2007.905604
  10. http://ko.jahwa.co.kr/main.asp
  11. Ansoft Corporation, Korea, Ansoft HFSS, Ver. 10.1