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http://dx.doi.org/10.5515/KJKIEES.2008.19.8.933

Composite EBG Power Plane Using Magnetic Materials for SSN Suppression in High-Speed Digital Circuits  

Eom, Dong-Sik (Department of Electronics Engineering, Ajou University)
Kim, Dong-Yeop (Department of Electronics Engineering, Ajou University)
Byun, Jin-Do (Department of Electronics Engineering, Ajou University)
Lee, Hai-Young (Department of Electronics Engineering, Ajou University)
Publication Information
Abstract
In this paper, a new composite electromagnetic bandgap(EBG) structure using magnetic materials is proposed for simultaneous switching noise(SSN) suppression in the high-speed digital circuits. The proposed EBG structure has periodic unit cells of square-patches connected by spiral-shaped bridges. The magnetic materials are located on the unit cells of spiral-shaped EBG. The real part of the permeability shifts bandgap to the lower frequency region due to the increased effective inductance. The imaginary part of the permeability has magnetic loss that decreases parasitic LC resonance peaks from between the unit cells. As a result, the proposed structure has the lower cut-off frequency compared with conventional EBG structure and -30 dB SSN suppression bandwidth from 175 MHz to 7.7 GHz. The proposed structure is expected to improve the power integrity and reduce the size of the EBG power plane.
Keywords
Elelctromagnetic Bandgap(EBG); Simultaneous Switching Noise(SSN); Magnetic Materials; High-Speed Digital Circuits;
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1 M. Xu, T. H. Hubing J. Chen, T. P. Van Doren, J. L. Drewniak, and R. E. DuBroff, 'Power-bus decoupling with embedded capacitance in printed circuit board design', IEEE Trans. Electromagn. Compat., vol. 45, no. 1, pp. 22-30, Feb. 2003   DOI   ScienceOn
2 T. L. Wu, Y. H. Lin, T. K. Wang, C. C. Wang, and S. T. Chen, 'Electromagnetic bandgap power/gound planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits', IEEE Microw. Theory Tech., vol. 53, no. 9, Sep. 2005
3 V. Ricchiuti, 'Power-supply decoupling on fully populated high-speed digital PCBs', IEEE Trans. Electromagn. Compat., vol. 43, no. 4, pp. 671-676, Nov. 2001   DOI   ScienceOn
4 T. Kamgaing, O. M. Ramahi 'A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface', IEEE Microw. Compon. Lett., vol. 13, no. 1, pp. 21-23, Jan. 2003   DOI   ScienceOn
5 T. L. Wu, C. C. Wang, Y. H. Lin, T. K. Wang, and G. Chang, 'A novel power plane with super wideband elimination of ground bounce noise on high speed circuits', IEEE Microw. Wireless Compon. Lett., vol. 15, no. 3, pp. 174-176, Mar. 2005   DOI   ScienceOn
6 http://ko.jahwa.co.kr/main.asp
7 R. Abhari, G. V. Eleftheriades, 'Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high speed circuits', IEEE Trans. Microw. Theory Tech., vol. 51, no. 6, pp. 1629-1639, Jun. 2003   DOI   ScienceOn
8 S. H. Joo, D. Y. Kim, and H. Y. Lee 'A S-bridged inductive electromagnetic bandgap power plane for suppression of ground bounce noise', IEEE Microw. Wireless Compon. Lett., vol. 17, no. 10, pp. 709- 711, Oct. 2007   DOI   ScienceOn
9 Ansoft Corporation, Korea, Ansoft HFSS, Ver. 10.1
10 Y. Toyota, K. Iokibe, R. Koga, A. E. Engin, T. H. Kim, and M. Swaminathan, 'Miniaturization of electromagnetic bandgap structures with high-permeability magnetic metal sheet', IEEE Int. Symp. Electromagn. Compat., Jul. 2007
11 T. L. Wu, C. C. Wang, Y. H. Lin, T. K. Wang, and G. Chang, 'A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures', IEEE Microw. Wireless Compon. Lett., vol. 14, no. 7, pp. 337-339, Jul. 2004   DOI   ScienceOn