Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Failure Analysis of BGA Test Socket Pins

BGA 검사 소켓 핀의 불량 분석 연구

  • Kim, Myung-Sik (Department of Electronic Materials Engineering, The University of Suwon) ;
  • Bae, Kyoo-Sik (Department of Electronic Materials Engineering, The University of Suwon)
  • 김명식 (수원대학교 전자재료공학과) ;
  • 배규식 (수원대학교 전자재료공학과)
  • Published : 2008.09.27
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Abstract

BGA test sockets failed earlier than the expected life-time due to abnormal signal delay, shown especially at the low temperature ($-50^{\circ}C$). Analysis of failed sockets was conducted by EDX, AES, and XRD. A SnO layer contaminated with C was found to form on the surface of socket pins. The formation of SnO layer was attributed to the repeated Sn transfer from BGA balls to pin surface and instant oxidation of fresh Sn. As a result, contact resistance increased, inducing signal delay. Abnormal signal delay at the low temperature was attributed to the increasing resistivity of Sn oxide with decreasing temperature, as manifested by the resistance measurement of $SnO_2$.

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