Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 15 Issue 2
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- Pages.37-45
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- 2008
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Reliability Studies on Cu/SnAg Double-Bump Flip Chip Assemblies for Fine Pitch Applications
미세피치용 Cu/SnAg 더블 범프 플립칩 어셈블리의 신뢰성에 관한 연구
- Son, Ho-Young (Dept. of Materials Science and Engineering, KAIST) ;
- Kim, Il-Ho (Dept. of Mechanical Engineering, KAIST) ;
- Lee, Soon-Bok (Dept. of Mechanical Engineering, KAIST) ;
- Jung, Gi-Jo (Corporate R&D Center, NEPES Corporation) ;
- Park, Byung-Jin (Corporate R&D Center, NEPES Corporation) ;
- Paik, Kyung-Wook (Dept. of Materials Science and Engineering, KAIST)
- 손호영 (한국과학기술원 신소재공학과) ;
- 김일호 (한국과학기술원 기계공학과) ;
- 이순복 (한국과학기술원 기계공학과) ;
- 정기조 (㈜네패스 반도체 연구소) ;
- 박병진 (㈜네패스 반도체 연구소) ;
- 백경욱 (한국과학기술원 신소재공학과)
- Published : 2008.06.30
Abstract
In this study, reliabilities of Cu (60 um)/SnAg (20 um) double-bump flip chip assemblies were investigated for the flip chip interconnections on organic substrates with 100 um pitch. After multiple reflows at
본 논문에서는 유기 기판 위에
Keywords
- Cu/SnAg double-bump;
- Cu column;
- Fine pitch flip chip;
- High temperature storage test;
- Electromigration;
- Thermal cycling