한국자동차공학회논문집 (Transactions of the Korean Society of Automotive Engineers)

  • 제16권3호
  • /
  • Pages.15-22
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  • 2008
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  • 1225-6382(pISSN)
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  • 2234-0149(eISSN)
한국자동차공학회 (The Korean Society of Automotive Engineers)
권호 표지

반도체 패키지의 경계요소법에 의한 균열진전경로의 예측

Prediction of Crack Propagation Path Using Boundary Element Method in IC Packages

  • 정남용 (숭실대학교 기계공학과)
  • Chung, Nam-Yong (Department of Mechanical Engineering, Soongsil University)
  • 발행 : 2008.05.01
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초록

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

키워드

참고문헌

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