Journal of Institute of Control, Robotics and Systems (제어로봇시스템학회논문지)

Institute of Control, Robotics and Systems (제어로봇시스템학회)
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Development of Inspection System for the IC package

반도체 패키지 외관 검사 시스템 개발

  • 이정섭 (호서대학교 디지털디스플레이공학과) ;
  • 권오민 (호서대학교 전자공학과) ;
  • 주효남 (호서대학교 디지털디스플레이공학과) ;
  • 김준식 (호서대학교 전자공학과) ;
  • 류근호 (호서대학교 로봇공학과)
  • Published : 2008.05.01
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Abstract

In this paper, new inspection method is proposed for the surfaces of lead frame and IC's. Optimal optical system and the accurate algorithm for the surface inspection are needed in machine vision area. The proposed optical system is composed of rectangular oblique light illumination and coaxial light illumination for the higher contrast and the results shows the better performances through experiments. The markings of IC surface are inspected using the accurate proposed method using the partitioned correlation coefficient, and the result shows reduction of under kill ratio compared to the previous method.

Keywords

References

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