Transactions of the Korean Society of Machine Tool Engineers (한국공작기계학회논문집)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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Composite $BaTiO_3$ Embedded capacitors in Multilayer Printed Circuit Board

다층 PCB에서의 $BaTiO_3$ 세라믹 Embedded capacitors

  • 유희욱 (광운대학교 전자재료공학과) ;
  • 박용준 (광운대학교 전자재료공학과) ;
  • 고중혁 (광운대학교 전자재료공학과)
  • Published : 2008.04.15
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Abstract

Embedded capacitor technology is one of the effective packing technologies for further miniaturization and higher performance of electric packaging system. In this paper, the embedded capacitors were simulated and fabricated in 8-layered printed circuit board employing standard PCB processes. The composites of barium titanante($BaTiO_3$) powder and epoxy resin were employed for the dielectric materials in embedded capacitors. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of simulated and fabricated embedded capacitors was investigated. Fabricated embedded capacitors have lower self resonance frequency values than that of the simulated embedded capacitors due to the increased parasitic inductance values. Frequency dependent capacitances of fabricated embedded capacitors were well matched with those of simulated embedded capacitors from the 100MHz to 10GHz range. Quality factor of 20 was observed and simulated at 2GHz range in the 10 pF embedded capacitors. Temperature dependent capacitance of fabricated embedded capacitors was presented.

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References

  1. Han, S. Y., Kim, M. S., Hwang, J. S., Choi, S. H., Park, J. Y., and Lee, B. J., 2007, "Development of a materials mixing method for topology optimization of PCB substrate," Trans of the Korean Society of Machine Tool Engineers, Vol. 16, No. 1, pp. 47-52
  2. Rector, J., 1998, "Economic and Technical Viability of Integral Passive," Proceedings of 48th Electronic Components and Technology Conference., Seattle, WA, pp. 218-224
  3. Su, B. and Button. T. W., 2001, "The processing and properties of barium strontium titanate thick films for use in frequency agaile microwave circuit applications," J. of Eur. Ceram. Soc., Vol. 21, pp. 2641-2645 https://doi.org/10.1016/S0955-2219(01)00330-2
  4. Parkerson, J. P., Schaper. L. W., and Lenihan, T. G., 1997, "Design Considerations for Using Integrated Passive Components," International Conference on Multichip Modules MCM, pp. 345-350
  5. Bhattacharya, S. K. and Tummala, R. R., 2000, "Next Generation Integral Passives: Materials, Process, and Integration of Resistors and Capacitors on PWB substrates," J. Mater. Sci: Materials in Electronics, Vol. 11, No. 3, pp. 253-268 https://doi.org/10.1023/A:1008913403211