Design & Manufacturing
- Volume 2 Issue 5
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- Pages.21-24
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- 2008
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- 2800-0323(pISSN)
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- 2733-452X(eISSN)
Development of Mold-Die for Mobile Phone Component
핸드폰 부품 제작용 금형개발
- Kim, Hyung-Kook (Yeungjin College) ;
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Yon, Kyu-Hyun
(Yeungjin College)
- Received : 2008.06.17
- Accepted : 2008.09.26
- Published : 2008.10.01
Abstract
On this study, injection molding product of rectangular tray structure with thickness 0.25mm and aspect ratio(length/thickness) approximately 150 conducted. Technical aspects were reviewed on mold-die design and injection molding conditions. To have a thin-membraned plastic part, short-shot, shrinkage, twist, whitening and flash problems were considered and resolved. After measuring products, validity of this study and future improvement were discussed.
Keywords