한국표면공학회지 (Journal of Surface Science and Engineering)

  • 제41권6호
  • /
  • Pages.325-330
  • /
  • 2008
  • /
  • 1225-8024(pISSN)
  • /
  • 2288-8403(eISSN)
한국표면공학회 (The Korean Institute of Surface Engineering)
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열처리 본딩 기술을 이용한 Al6061/Al6061 및 Al6061/Sus304의 기계적 및 전기적 특성에 관한 실험적 연구

An Experimental Study on Electrical and Mechanical Characteristics of Al6061/Al6061 and Al6061/Sus304 by Using Thermal Bonding Technology

  • 유충준 (경기 대학교 공과대학 기계시스템공학부) ;
  • 정원채 (경기 대학교 공과대학 전자공학부)
  • You, Chung-Jun (Dept. of Mechanical System Engineering, Kyonggi University) ;
  • Jung, Won-Chae (Dept. of Electronic Engineering, Kyonggi University)
  • 발행 : 2008.12.31
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초록

Al6061 and Sus304 materials are bonded by using thermal bonding technology. Al6061, Sus304 and thermal bonded Al6061/Al6061 and Al6061/Sus304 materials are characterized by using mechanical and electrical measurement. Especially the experimental characteristic data of thermal bonded Al6061/Al6061 and Al6061/Sus304 are not well known until today. We have investigated on Al6061, Sus304 and thermal bonded material. The thermal bonded material Al6061/Al6061 and Al6061/Sus304 can be used for the LCD frame and the other electrical products. For the future, we expect that the more various experiments should be needed to carry out for the data accumulation in the bonded new materials.

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참고문헌

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