The Study on the Machining Characteristics of 4 inch Wafer for the Optimal Condition

최적 가공 조건을 위한 4인치 웨이퍼의 가공 특성에 관한 연구

  • 원종구 (인하대학교 기계공학과 대학원) ;
  • 이정택 (인하대학교 기계공학과 대학원) ;
  • 이정훈 (인하대학교 기계공학과 대학원) ;
  • 이은상 (인하대학교 기계공학과)
  • Published : 2007.10.15

Abstract

Single side final polishing is a very important role to stabilize a wafer finally before the device process on the wafer is executed. In this study, the machining variables, such as pressure, machining time, and the velocity of pad table were adopted. These parameters have the major influence on the characteristics of wafer polishing. We investigated the surface roughness changing these variables to find the optimal polishing condition. Pad, slurry, slurry quantity, and oscillation distance were set to the fixed variables. In order to reduce defects and find a stable machining condition, a hall sensor was used on the polishing process. AE sensor was attached to the polishing machine to verify optimal condition. Applying data analysis of the sensor signal, experiments were performed. We can get better surface roughness from loading the quasi static force and improving wafer-holding method.

Keywords

References

  1. Shin, Y. J., Lee, E. S. and Kang, J. H., 2000, 'Identification of the Mechanical Aspects of Material Removal Mechanisms in CMP,' Transactions of the Korean Society of Machine Tool Engineers, Vol. 9, No. 5, pp. 7-12
  2. Kwon, D. H., Kim, H. J.,and Jeong, H. D., 2002, 'A Study on the Decay of Friction Force during CMP,' Journal of the Korean Society of Precision Engineering, pp. 972-975
  3. Park, K. T., Lee, B. R., Park, K. Y. and Hong, D. P., 2000, 'A Study on the Fracture Behavior in Silicon Wafer Using the Ultra-Precision Micro Positioning System,' Transactions of the Korean Society of Machine Tool Engineers, Vol. 9, No. 1, pp. 38-44
  4. Kim, J. D., Kim, S. R., Kim, H. Y. and Ahn, J. H., 2001, 'Development of Acoustic Emission Sensor Using Piezoelectric Elements and Monitoring System for Polishing Process,' Journal of the Korean Society of Precision Engineering, pp. 560-565
  5. Song, J. B., Lee, E. S. and Kim, N. H., 2000, 'A Study on the Evaluation of Machinging States in the Plunge Grinding Using the Current Signals of a Spindle Motor,' Journal of the Korean Society of Precision Engineering, Vol. 17, No. 6, pp. 76-82