Transactions on Electrical and Electronic Materials

  • 제8권1호
  • /
  • Pages.15-20
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  • 2007
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  • 1229-7607(pISSN)
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  • 2092-7592(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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Diamond Conditioner Wear Characterization for a Copper CMP Process

  • Boruckia, L. (Araca, Inc.) ;
  • Zhuang, Y. (Araca, Inc.) ;
  • Kikuma, R. (Mitsubishi Materials Corporation) ;
  • Rikita, N. (Mitsubishi Materials Corporation) ;
  • Yamashita, T. (Mitsubishi Materials Corporation) ;
  • Nagasawa, K. (Mitsubishi Materials Corporation) ;
  • Lee, H. (The University of Arizona) ;
  • Sun, T. (The University of Arizona) ;
  • Rosales-Yeomans, D. (The University of Arizona) ;
  • Philipossian, A. (The University of Arizona) ;
  • Stout, T (Veeco Instruments, Inc.)
  • 발행 : 2007.02.28
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초록

Conditioner wear, copper polish rates, pad temperature and coefficient of friction (COF) are measured for two novel Mitsubishi Materials Corporation designs during an extended wear and polishing test. Both designs are coated with a $Teflon^{TM}$ film to reduce substrate wear and chemical attack. Using optical interferometry, changes in the coating that result in gradual changes in diamond exposure are measured. Theories of the COF, conditioning, and polishing are applied to explain the observed performance differences between the designs.

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참고문헌

  1. L. Borucki, Y. Sampumo, Y. Zhuang, A. Philipossian, T. Merchant, and J. Zabasajja, 'Measurement of Diamond Conditioner Microwear', Proc. of 22nd VLSI Multilevel Interconnection Conference (VMIC), p. 441, 2005
  2. L. Borucki, Y. Zhuang, and A. Philipossian, 'Physics and Modeling of Fundamental CMP Phenomena', Proc. of 22nd VLSI Multilevel Interconnection Conference (VMIC), p. 175, 2005
  3. L. J. Borucki, T. Witelski, C. P. Please, P. R. Kramer, and D. Schwendeman, 'A theory of pad conditioning for chemical mechanical polishing', J. of Engineering Mathematics, Vol. 50, p. 1, 2004 https://doi.org/10.1023/B:ENGI.0000042116.09084.00
  4. J. Sorooshian, L. Borucki, D. Stein, R. Timon, D. Hetherington, and A. Philipossian, 'Revisiting the removal rate model for oxide CMP', Trans. ASME J. Tribology, Vol. 127, No.3, p. 639, 2005 https://doi.org/10.1115/1.1866168
  5. K. L. Johnson, 'Contact Mechanics', Cambridge U. Press, 1985

피인용 문헌

  1. Diamond Conditioner Microwear Effect on Pad Surface Height Distribution in Tungsten Chemical Mechanical Polishing vol.50, pp.5, 2011, https://doi.org/10.1143/JJAP.50.05EC05
  2. Diamond Conditioner Microwear Effect on Pad Surface Height Distribution in Tungsten Chemical Mechanical Polishing vol.50, pp.5S1, 2011, https://doi.org/10.7567/JJAP.50.05EC05