Transactions of the Korean Society of Machine Tool Engineers (한국공작기계학회논문집)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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A Study on Thermal Stress Analysis of Plastic-Core Solder Balls

플라스틱 핵 솔더볼의 열응력 해석에 관한 연구

  • 김환동 (광운대학교 대학원 화학공학과) ;
  • 윤도영 (광운대학교 화학공학과)
  • Published : 2007.12.15
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Abstract

Recently, Pb-free solder ball technology, which is getting more significant in miniaturization of electronic equipment, and resolution of recent environmental problems, is necessary to be developed. A plastic-core solder ball is much promising in those considerations. Plastic-core solder balls have the tendency to replace the usual metal-core solder ball from low material cost and superior mechanical properties. The thermal effects, however, are important in manufacturing process, such as deposing micro-sized metal thin film on the spherical polymer surface. Furthermore plastic-core solder balls are easy to be broken due to CTE and elastic coefficient of material property from heat transfer. We propose technical computational investigations for the manufacturing design and the reliability of plastic-core solder ball from thermal stress analysis.

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References

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