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A Study on Thermal Stress Analysis of Plastic-Core Solder Balls  

Kim, H.D. (광운대학교 대학원 화학공학과)
Yoon, D.Y. (광운대학교 화학공학과)
Publication Information
Transactions of the Korean Society of Machine Tool Engineers / v.16, no.6, 2007 , pp. 159-162 More about this Journal
Abstract
Recently, Pb-free solder ball technology, which is getting more significant in miniaturization of electronic equipment, and resolution of recent environmental problems, is necessary to be developed. A plastic-core solder ball is much promising in those considerations. Plastic-core solder balls have the tendency to replace the usual metal-core solder ball from low material cost and superior mechanical properties. The thermal effects, however, are important in manufacturing process, such as deposing micro-sized metal thin film on the spherical polymer surface. Furthermore plastic-core solder balls are easy to be broken due to CTE and elastic coefficient of material property from heat transfer. We propose technical computational investigations for the manufacturing design and the reliability of plastic-core solder ball from thermal stress analysis.
Keywords
Plastic core solder ball; Thermal stress; BGA; FVM;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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