References
- Hernandez-Velez, M. Thin Solid Films 2006, 495, 51 https://doi.org/10.1016/j.tsf.2005.08.331
- Sung, D. D.; Choo, M. S.; Noh, J. S.; Chin, W. B.; Yang, W. S. Bull. Korean Chem. Soc. 2006, 27, 1159 https://doi.org/10.5012/bkcs.2006.27.8.1159
- Li, C. Bull. Korean Chem. Soc. 2006, 27, 991 https://doi.org/10.5012/bkcs.2006.27.7.991
- Hoa, M. L. K.; Lu, M.; Zhang, Y. Adv. Colloid Interface Sci. 2006, 121, 9 https://doi.org/10.1016/j.cis.2006.05.029
- Diaz, D. J.; Williamson, T. L.; Gua, X.; Sood, A.; Bohn, P. W. Thin Solid Films 2006, 514, 120 https://doi.org/10.1016/j.tsf.2006.02.098
- Harrell, C. C.; Lee, S. B.; Martin, C. R. Anal. Chem. 2003, 75, 6861 https://doi.org/10.1021/ac034602n
- Zhao, S.; Roberge, H.; Yelon, A.; Veres, T. J. Am. Chem. Soc. 2006, 128, 12352 https://doi.org/10.1021/ja062148+
- Yang, Z.; Xia, Y.; Sun, X.; Mokaya, R. J. Phys. Chem. B 2006, 110, 18424 https://doi.org/10.1021/jp0639849
- Nishizawa, M.; Menon, V. P.; Martin, C. R. Science 1995, 268, 700 https://doi.org/10.1126/science.268.5211.700
- Martin, C. R.; Nishizawa, M.; Jirage, K.; Kang, M. J. Phys. Chem. B 2001, 105, 1925 https://doi.org/10.1021/jp003486e
- Gasparac, R.; Mitchell, D. T.; Martin, C. R. Electrochim. Acta 2004, 49, 847 https://doi.org/10.1016/j.electacta.2003.09.037
- Reynes, O.; Demoustier-Champagne, S. J. Electrochem. Soc. 2005, 152, D130 https://doi.org/10.1149/1.1997163
- Hoa, M. L. K.; Lu, M.; Zhang, Y. Adv. Coll. Interf. Sci. 2006, 121, 9 https://doi.org/10.1016/j.cis.2006.05.029
- Zhang, B. J.; Davis, S. A.; Mendelson, N. H.; Mann, S. Chem. Commun. 2000, 9, 781
- Park, S.; Lim, J.-H.; Chung, S.-W.; Mirkin, C. A. Science 2004, 303, 348 https://doi.org/10.1126/science.1093276
- Menon, V. P.; Martin, C. R. Anal. Chem. 1995, 67, 1920 https://doi.org/10.1021/ac00109a003
- Yamada, K.; Gasparac, R.; Martin, C. R. J. Electrochem. Soc. 2004, 151, E14 https://doi.org/10.1149/1.1629097
- Apel, P. Yu.; Blonskaya, I. V.; Dmitriev, S. N.; Orelovitch, O. L.; Sartowska, B. J. Membr. Sci. 2006, 282, 393 https://doi.org/10.1016/j.memsci.2006.05.045