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Analysis Method of Metallic ion Migration  

Hong Won-Sik (전자부품연구원 신뢰성평가센터)
Jung Seung-Boo (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
Kim Kwang-Bae (한국항공대학교 항공재료공학과)
Publication Information
Journal of Welding and Joining / v.23, no.2, 2005 , pp. 32-40 More about this Journal
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  • Reference
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