Acknowledgement
Supported by : 조선대학교
References
- S. D. Park, H. G. Kang, Y. H. Park and J. D. Mun, J. Microelectrics and packaging Soc., 40 (1999) 25
- M. Skurski, M. Smith, R. Draudt, D. amey; S. Horowiz and M. Champ, Int. J. Microcircuits and Electronic Packaging, 21 (1998) 355
- K. Nagashima, T. Himeda and A. Kanto, J. Mater. Sci., 26 (1991) 2477 https://doi.org/10.1007/BF01130198
- M. Furusawa, T, Hashimoto, M. Ishida, T. Shimoda, H. Hasei, T. Hirai, H. Kiguchi, H. Aruga, M. Oda, N. Saito, H. Iwashige, N. Abe, S. Fukuta and K. Betsui, SID'02 Digest, (2002) 752
- K. S. Chou and C. Y. Ren, Mater. Chem. and Phys., 64 (2000) 241
- T. Fujimoto, 'New Introduction to Surface Active Agents', Sanyo Chemical Industries Ltd. 1984
- M. S. Kim, Specialty Chemical Symposium, (1991) 79
- Y. Xuan and Q. Li, Int. J. Heat Fluid Fl. 21 (2000) 58 https://doi.org/10.1016/S0142-727X(99)00067-3
- S. Kundu, S. K. Chosh, M. Mandai and T. Pal, Bull. Mater. Sci., 6 (2002) 577
- N. Shirtcliffe, U. Nickel and S. Schneider, J. Collid Interface Sci., 211 (1999) 122 https://doi.org/10.1006/jcis.1998.5980
- A. M. Ahern and R. I. Garrell, Anal. Chem., 59 (1987) 2816 https://doi.org/10.1021/ac00150a021
- C. C. Vukovic and J. M. Nedeljkovic, Langmuir, 9 (1993) 980 https://doi.org/10.1021/la00028a017