References
- Zhu, J.-G., Zheng, Y. and Prinz, G. A., 'Ultrahigh Density Vertical Magnetoresistive Random Access Memory,' J. Appl. Phys., 87, 6668-6673(2000) https://doi.org/10.1063/1.372805
- Tehrani, S., Chen, E., Durlam, M., De Herrera, M., Slaughter, J. M., Shi J. and Kerszykowski, G., 'High Density Submicron Magnetoresistive Random Access Memory,' J. Appl. Phys., 85, 5822-5827(1999) https://doi.org/10.1063/1.369931
- Gallagher, W. J., Parkin, S. S. P., Lu, Y., Bian, X. P., Marley, A., Roche, K. P., Altman, R. A., Rishton, S. A., Jahnes, C., Shaw, T. M. and Xiao, G., 'Microstructured Magnetic Tunnel Junction,' J. Appl. Phys., 81, 3741-3746(1997) https://doi.org/10.1063/1.364744
- Gokan, H. and Esho, S., 'Pattern Fabrication by Oblique Incidence Ion-Beam Etching,' J. Vac. Sci. Technol., 18, 23-27(1981) https://doi.org/10.1116/1.570693
-
Vasile, M. J. and Mogab, C. J., 'Chemically Assisted Sputter Etching of Permalloy using CO or
$Cl_2$ ,' J. Vac. Sci. Technol. A, 4, 1841-1849(1986) https://doi.org/10.1116/1.573775 -
Jung, K. B., Cho, H., Hahn, Y. B., Hays, D. C., Lambers, E. S., Park, Y. D., Feng, T., Childress, J. R. and Pearton, S. J., 'Effect of Inert Gas Additive on
$Cl_2$ -Based Inductively Coupled Plasma Etching of NiFe and NiFeCo,' J. Vac. Sci. Technol. A, 17, 2223-2227(1999) https://doi.org/10.1116/1.581751 -
Jung, K. B., Cho, H., Hahn, Y. B., Hays, D. C., Lambers, E. S., Park, Y. D., Feng, T., Childress, J. R. and Pearton, S. J., 'Relative Merits of
$Cl_2$ and CO/$NH_3$ Plasma Chemistries for Dry Etching of Magnetic Random Access Memory Device Elements,' J. Appl. Phys., 85, 4788-4790(1999) https://doi.org/10.1063/1.370482 - Jung, K. B., Cho, H., Hahn, Y. B., Hays, D. C., Lambers, E. S., Park, Y. D., Feng, T., Childress, J. R. and Pearton, S. J., 'Interhalogen Plasma Chemistries for Dry Etch Patterning of Ni, Fe, NiFe and NiFeCo Thin Films,' Appl. Surf. Sci., 140, 215-222(1999) https://doi.org/10.1016/S0169-4332(98)00598-4
- Hong, J., Caballero, J. A., Lambers, E. S., Childress, J. R., Pearton, S. J., Jenson, J., M. and Hurst, A. T., 'High Density Plasma Etching of NiFe, NiFeCo and NiMnSb-Based Multilayers for Magnetic Storage Elements,' Appl. Surf. Sci., 138, 111-116(1999) https://doi.org/10.1016/S0169-4332(98)00417-6
-
Park, J. S., Kim, T. H., Chang, C. S. and Hahn, Y. B., 'Dry Etching of
$SrBi_2Ta_2O_9$ : Comparison of Inductively Coupled Plasma Chemistries,' Korean J. Chem. Eng., 19(3), 486-490(2002) https://doi.org/10.1007/BF02697161 -
Hahn, Y. B., Hays, D. C., Cho, H., Jung, K. B., Abernathy, C. R. and Pearton, S. J., 'Effect of Inert Gas Additive Species on
$Cl_2$ High Density Plasma Etching of Compound Semicondutors: Part I. GaAs and GaSb,' Appl. Surf. Sci., 147, 207-214(1999) https://doi.org/10.1016/S0169-4332(99)00114-2 - Shul, R. J. and Pearton, S. J. (Eds.), Handbook of Advanced Plasma Processing Techniques, 1st ed., Springer, New York(2000)