마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제12권3호
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- Pages.253-258
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- 2005
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
전기도금법으로 제조한 Ni 박막의 전기비저항 및 솔더 반응성
Electrical Resistivity and Solder-Reaction Characteristics of Ni Films Fabricated by Electroplating
- 이광용 (홍익대학교 신소재공학과) ;
- 원혜진 (홍익대학교 신소재공학과) ;
- 전성우 (홍익대학교 신소재공학과) ;
- 오택수 (홍익대학교 신소재공학과) ;
- 변지영 (한국과학기술연구원 금속공정연구센터) ;
- 오태성 (홍익대학교 신소재공학과)
- Lee Kwang-Yong (Department of Materials Science and Engineering, Hongik University) ;
- Won Hye-Jin (Department of Materials Science and Engineering, Hongik University) ;
- Jun Sung-Woo (Department of Materials Science and Engineering, Hongik University) ;
- Oh Teck-Su (Department of Materials Science and Engineering, Hongik University) ;
- Byun Ji-Young (Center for Materials Processing, Korea Institute of Science and Technology) ;
- Oh Tae-Sung (Department of Materials Science and Engineering, Hongik University)
- Published : 2005.09.01
Abstract
도금전류밀도에 따른 Ni박막의 결정립 크기, 전기비저항, 솔더 wetting angle 및 금속간화합물의 성장속도를 분석하였다. 도금전류밀도를
Characteristics of electroplated Ni films such as grain size, resistivity, solder wetting angle, and growth rate of intermetallic compound were evaluated as a function of electroplating current density. With increasing the electroplating current density from
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