Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 12 Issue 2 Serial No. 35
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- Pages.111-119
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- 2005
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Interconnection Process and Electrical Properties of the Interconnection Joints for 3D Stack Package with $75{\mu}m$ Cu Via
$75{\mu}m$ Cu via가 형성된 3D 스택 패키지용 interconnection 공정 및 접합부의 전기적 특성
- Lee Kwang-Yong (Dept. of Materials Science & Engineering, Hongik University) ;
- Oh Teck-Su (Dept. of Materials Science & Engineering, Hongik University) ;
- Won Hye-Jin (Dept. of Materials Science & Engineering, Hongik University) ;
- Lee Jae-Ho (Dept. of Materials Science & Engineering, Hongik University) ;
- Oh Tae-Sung (Dept. of Materials Science & Engineering, Hongik University)
- 이광용 (홍익대학교 신소재공학과) ;
- 오택수 (홍익대학교 신소재공학과) ;
- 원혜진 (홍익대학교 신소재공학과) ;
- 이재호 (홍익대학교 신소재공학과) ;
- 오태성 (홍익대학교 신소재공학과)
- Published : 2005.06.01
Abstract
Stack specimen with three dimensional interconnection structure through Cu via of
직경