참고문헌
- K. H. Kim, H. J. Chung, S. H. Yoon, S. W. Hwang, J. W. Park, S. W. Kim, J. H. Choi, and D. Ahn, 'Full Software Analysis and Impedance Matching of Radio Frequency CMOS Integrated Circuits,' IEEE Trans. on Components and Packaging Tech., Vol. 23, no. 1, pp. 183-186, March 2000 https://doi.org/10.1109/6144.833059
- Dean L. Monthei, 'Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications,' Kluwer Academic Publishers, pp. 43-120, 1999
- Luc Martens, 'High-frequency Characterization of Electronic Packaging,' Kluwer Academic Publishers, 1999