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New High-Frequency Equivalent Circuit Model for QFP Package  

Kim Sung-Jong (중앙대학교 전자전기공학부)
Song Sang-Hun (중앙대학교 전자전기공학부)
Publication Information
The Transactions of the Korean Institute of Electrical Engineers C / v.54, no.7, 2005 , pp. 339-342 More about this Journal
Abstract
We present a new high-frequency equivalent circuit model for 52pin QFP used in typical IC's and extract R, L, and C values of this circuit model using a 3-D E & M field simulator. Futhermore, L and C value variations as a function of Pin number due to the shape differences of the leads have been fitted to 2nd order polynomials in order to extend the applicability of this model.
Keywords
QFP; Bonding Wire; Lead Frame; S-parameters; Radio Frequency;
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