New High-Frequency Equivalent Circuit Model for QFP Package
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Kim Sung-Jong
(중앙대학교 전자전기공학부)
Song Sang-Hun (중앙대학교 전자전기공학부) |
1 | K. H. Kim, H. J. Chung, S. H. Yoon, S. W. Hwang, J. W. Park, S. W. Kim, J. H. Choi, and D. Ahn, 'Full Software Analysis and Impedance Matching of Radio Frequency CMOS Integrated Circuits,' IEEE Trans. on Components and Packaging Tech., Vol. 23, no. 1, pp. 183-186, March 2000 DOI ScienceOn |
2 | Dean L. Monthei, 'Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications,' Kluwer Academic Publishers, pp. 43-120, 1999 |
3 | Luc Martens, 'High-frequency Characterization of Electronic Packaging,' Kluwer Academic Publishers, 1999 |
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