대한전기학회논문지:전기물성ㆍ응용부문C (The Transactions of the Korean Institute of Electrical Engineers C)

대한전기학회 (The Korean Institute of Electrical Engineers)
권호 표지

패키지 박리 개선을 위한 플라즈마 세정 효과

Plasma Cleaning Effect for Improvement of Package Delamination

  • 발행 : 2005.07.01
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초록

The effect of plasma cleaning was examined on package delamination phenomena in the integrated circuit (IC) packaging process. Without plasma cleaning, delamination was observed for all three experimental treatments applied after the packaging step, which include bake of If, reflow, and bake of If followed by reflow However, no delamination was observed when the plasma cleaning was performed before and after the wire bonding step. Plasma cleaning was found to be a critical step to improve the reliability of the package by reducing the possibility of contact failure between die pad and bonding wire.

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참고문헌

  1. Chai TC, C. Lee, Ma YY, W. EH, Zhang XW, D. Pinjala, SS. Murthy and T. PS, 'Reliability Assessment of Flip Chip on Build Up Laminate Based Multi-Chip Package,' Electronic Components and Technology Conference, pp. 747-752, 2002 https://doi.org/10.1109/ECTC.2002.1008181
  2. Richard van Gestel, Kees de Zeeuw, Leo van Gemert and Eef Bagerman, 'Comparison of Delamination Effects between Temperature Cycling Test and Highly Accelerated Stress Test in Plastic Packaged Devices,' IRPS, pp.177-181, 1992
  3. G. Subbarayan, K. Ramarkrishna and B.G. Sammakia, 'The Impact of Interfacial Adhesion on PTH ans via Stress,' Transactions of the ASE, vol.119, pp.260-267, 1997
  4. Richard van Gestel, Han Scheltekens, '3D Finite Element Simulation of the Delamination Behaviour of a PLCC Package in the Temperature Cycling Test,' IRPS, pp.108-121, 1993
  5. Rajesh Swaminathan, Harish Bhaskaran, Peter A. Sandborn, Michael A. Deels, and Kevin R. Cochran, 'Reliability Assessment of Delamination in Chip to Chip Bonded MEMS Packaging,' IEEE Trans. on advanced Packaging, vol.26, no.2, May 2003 https://doi.org/10.1109/TADVP.2003.817344