대한전자공학회논문지SD (Journal of the Institute of Electronics Engineers of Korea SD)

대한전자공학회 (The Institute of Electronics and Information Engineers)
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PCB 기판용 FRP 재료의 열화특성

Degradation characteristics of the FRP material for using as a PCB substrate

  • Park Jong Kwan (Dept. of Information & Communication, Yuhan College)
  • 발행 : 2004.12.01
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초록

본 연구는 PCB 기판용 FRP 재료의 열화현상을 규명하기 위하여 열 및 방전에 의한 열화를 각각 모의하여 표면에서의 화학적, 정전적 상관관계를 조사하였다. 열 처리에 따른 시료의 특성변화는 $200^{\circ}C$ 까지는 표면의 소수화로 인하여 접촉각 및 표면전위가 증가하였다. XPS에 의한 분석결과 열처리에 따라 표면측쇄상 산소기의 이탈과 탄소쇄의 불포화 이중결합의 증가로 처리시료에서는 소수성이 증가하였다. 또한 열처리로 인해 착색현상이 발생되었고, 이러한 현상은 ether기에 의해 발생된다는 것을 확인하였다. 방전 처리된 시료의 접촉각 및 표면전위는 표면에 카르복실기 라디칼을 포함하는 다량의 측쇄화가 집중적으로 발생되어 처리시간에 따라 급격한 친수화가 진행되었다.

In this study, heat and discharge treatments are arbitrary simulated for finding out the initiations and processes of surface degradation on the surface of polymer for using as a PCB substrate. Thermal-treatment changed the surface to the hydrophobic one with the increase of contact angle and surface potential decay, respectively. The XPS spectrum showed that the increased hydrophobicity in thermal treatment was originated from the continuous decrease of side-chains caused by secessions of oxygen groups and the increase of unsaturated double bond in carbon chains. Also, thermal-treatment caused the discoloration on the point of treated surface. These phenomena were attributed to the generation of ether group. In the chemical change by discharge treatment, a lot of side-chains occurred on the treated surface, and so the hydrophilicity increased as time elapsed.

키워드

참고문헌

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