한국정밀공학회지 (Journal of the Korean Society for Precision Engineering)

한국정밀공학회 (Korean Society for Precision Engineering)
권호 표지

In-plane ESPI를 이용한 고온에서 STS430의 열팽창계수 측정

Thermal Expansion Coefficient Measurement of STS430 at High Temperature by In-plane ESPI

  • 발행 : 2004.11.01
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

This paper presents ESPI system for the measurement of thermal expansion coefficient of STS430 up to 1,00$0^{\circ}C$ . Existing methods, strain gauge and moire have the limitation of contact to object and do not supply the coefficient up to 80$0^{\circ}C$ . There needs to measure the data up to 80$0^{\circ}C$, because heat resistant materials have high melting temperature up to 1,000'E In previous studies related to thermal strain analysis, the quantitative results have not reported by ESPI at high temperature, yet. In-plane ESPI and vacuum chamber for the reduction of air turbulence and oxidation are designed for the measurement of the coefficient up to 1,00$0^{\circ}C$ and speckle correlation fringe pattern images are processed by commercial image filtering tool-smoothing, thinning and enhancement- to obtain quantitative results, which is compared with references data. The comparison shows two data are agreed within 4.1% blow $600^{\circ}C$ however, there is some difference up to $600^{\circ}C$. Also, the incremental ratio of the coefficient is changed up to 80$0^{\circ}C$ . The reason is the phase transformation of STS430 probably begins at 80$0^{\circ}C$

키워드

참고문헌

  1. Lokberg, O.J., 'ELECTRONIC SPECKLE PATTERN INTERFEROMETRY,' Physics in technology, No. 11, pp. 16-22, 1980 https://doi.org/10.1088/0305-4624/11/1/303
  2. Cloud, G.L., Optical Methods of Engineering Analysis, Cambridge University Press, pp.453-476, 1990
  3. Malmo, J. T., Lokberg, O. J. and Slettemoen, G. A., 'Interferometric Testing at Very High Temperatures by TV Holography (ESPI)', Experimental Mechanics, Sept., pp.315-321,1987 https://doi.org/10.1007/BF02329029
  4. Ratnam, M.M., Evans, W.T. and Tyrer, J.R., 'Measurement of thermal expansion of a piston using holographic and electronic speckle pattern interferometry,' Optical Engineering, Vol. 31, No. 1, pp. 61-69, 1992 https://doi.org/10.1117/12.56053
  5. Hack, Erwin and Bronnimann, Rolf, 'Electronic speckle pattern interferometry deformation measurement on lightweight structures under thermal load,' Optics and Lasers in Engineering, Vol. 31, pp.213-222, 1999 https://doi.org/10.1016/S0143-8166(99)00015-9
  6. Kim, I.K., Kim, K.S., Yoon, S.W., Kang, K.S., 'A Study on Vibration Characteristic of Thin Plate in Crack Propagation by Laser Holography Method,' Journal of the Korean Society of Precision Engineering, Vol. 17, No. 10, pp. 200-205, 2000
  7. Moore, A.J. and Tyrer, J.R., 'An Electronic speckle pattern interferometry for complete in-plane displacement measurement,' Measurement science and technology, Vol. 1, pp. 1024-1030, 1990 https://doi.org/10.1088/0957-0233/1/10/006
  8. kang, Y.J., Bea, J.K., You, W.J., Park, N.K., 'A Study on Measurement of Crack Length by using Laser Speckle Interferometry,' Journal of the Korean Society of Precision Engineering, Vol. 18, No. 5, pp. 34-41, 2001