대한기계학회논문집A (Transactions of the Korean Society of Mechanical Engineers A)

  • 제28권5호
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  • Pages.617-623
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  • 2004
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  • 1226-4873(pISSN)
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  • 2288-5226(eISSN)
대한기계학회 (The Korean Society of Mechanical Engineers)
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화학기계적 연마 프로세스의 동적 열전달 모델링 연구

A Dynamic Thermal Modeling of Chemical Mechanical Polishing Process

  • 발행 : 2004.05.01
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초록

This paper describes a dynamic thermal model for a representative dual axis rotational Chemical-Mechanical Polishing (CMP) tool. The model is one-dimensional but configured in the two-dimensional space and consists of three sub-models (pad, wafer and slurry fluid), with the first and the second that are time-dependent heat conduction-convection models with linear stationary (wafer) and nonlinear moving (pad) boundary conditions, and the last one that is a heat transport-convection model (slurry fluid). The modeling approach is validated by comparing the simulation results with available experimental data.

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참고문헌

  1. Steigerwald, J. M., Muraka, S. P. and Gutmann, R. J., 1997, Chemical Mechanical Planarization of Microelectronic Materials, New York, John Wiley & Sons
  2. Luo, J. and Dornfeld, D. A., 2001, 'Material Removal Mechanism in Chemical Mechanical Polishing: Theory and Modeling,' IEEE Trans. Semicon. Manufact. Vol. 14, No. 2, pp. 112-133 https://doi.org/10.1109/66.920723
  3. Preston, F., 1927, 'The Theory and Design of Plate Glass Polishing Machines,' J. Soc. Glass Technol. Vol. 11, pp. 214-256
  4. Greenwood, J. A. and P.Williamson, J. B., 1966, 'Contact of Norminally Flat Surfaces,' Proceedings of the Royal Society London, Vol. A 295, pp. 300-319
  5. Seok, J., Sukam, C. P., Kim, A. T., Tichy, J. A. and Cale, T. S., 2003, 'Multiscale Material Removal Modeling of Chemical Mechanical Polishing,' Wear, Vol. 254, pp. 307-320 https://doi.org/10.1016/S0043-1648(03)00022-X
  6. Shan, L., Levert, J. A., Tichy, J. and Danyluk, S., 2000, 'Interfacial Fluid Mechanics and Pressure Prediction in Chemical Mechanical Polishing,' Journal of Tribology, Vol. 122, No. 3, pp. 539-543 https://doi.org/10.1115/1.555398
  7. Runnels, S. R., Eyman, L. M., 1998, 'Tribology Analysis of Chemical-Mechanical Polishing,' J. Electrochem. Soc., Vol. 141, No. 6, pp. 1698-1701 https://doi.org/10.1149/1.2054985
  8. Cho, S. H., Kim, H. J. Kim, H. Y., Seo, H. D., Kim, K. J. and Jeong, H. D., 2001, 'A Study on the Improvement of the Slurry Dispersibility in CMP,' Journal of the Korean Society of Mechanical Engineers A, Vol. 25, No. 10, pp. 1535-1540
  9. Kwon, D. H., Kim, H. J., Jeong, H. D., Lee, E. S., Shin, Y. J., 2001, 'A Study of Temperature Behavior and Friction Force Generated by Chemical Mechanical Polishing,' Proceedings of the Korean Society of Precision Engineering Fall Meeting, pp. 939-942
  10. White, D., Melvin, J. and Boning, D., 2003, 'Characterization and modeling of dynamic thermal behavior in CMP,' J. Electrochem. Soc., Vol. 150, No. 4, pp. G271-G278 https://doi.org/10.1149/1.1560642
  11. Incropera, F. P. and DeWitt, D. P., 1985, Introduction of Heat Transfer, New York, John Wiley & Sons
  12. Mathworks, $Matlab^{TM}$ Version 6.1, 2001, Mathworks Inc.
  13. Bejan, A., 1988, Advanced Engineering Thermodynamics, New York, John Wiley & Sons