참고문헌
- J. Vac. Sci. Tech. A v.11 no.1 Copper Metalorganic Chemical Vapor Deposition Reactions of Hexafluoroacetylacetonate Cu(I) Vinyltrimethylsilane and bis (Hexafluoroacetylacetonate) Cu(II) Adsorbed on Titanium Nitride V. M. Donnelly;M. E. Gross
- J. Vac. Sci. Tech. A v.2 no.2 Barrier Layers : Principles and Applications in Microelectronics M. Wittmer https://doi.org/10.1116/1.572580
- J. Appl. Phys. v.68 no.10 Reactively Sputtered TiN as a Diffusion Barrier between Cu and Si S. Q. Wang;I. J. Raaijmakers;B. J. Burrow;S. Suther;S. Redkar;K. B. Kim https://doi.org/10.1063/1.347059
- IEEE Electron Device Lett. v.12 no.6 Sputtered Ta-Si-N Diffusion Barriers in Cu Metallizations for Si E. Kolawa;P. J. Polela;J. S. Reid;J. S. Chen;R. P. Ruiz;M. A. Nicolet https://doi.org/10.1109/55.82074
- Jpn. J. Appl. Phys. v.36 Correlation of W-Si-N Film Microstructure with Barrier Performance against Cu Diffusion Y. Shimooka;T. Iijima;S. Nakamura;K. Suguro https://doi.org/10.1143/JJAP.36.1589
-
Thin Solid Films
v.236
no.1;2
Evaluation of Amorphous(Mo, Ta, W)---Si---N Diffusion Barriers for
| Cu Metallizations J. S. Reid;E. Kolawa;R. P. Ruiz;M. A. Nicolet https://doi.org/10.1016/0040-6090(93)90689-M - Matt. Chem. Phys. v.57 no.1 Ta-Si-N as a Diffusion Barrier between Cu and Si C. M. Lee;Y.-H. Shin https://doi.org/10.1016/S0254-0584(98)00176-X
- Thin Solid Films v.320 no.1 Structural and Chemical Stability of TaSiN Thin Film between Si and Cu Y. J. Lee;B. S. Suh;S. K. Rha;C. O. Park https://doi.org/10.1016/S0040-6090(97)01078-X
- IEEE Electron Device Lett. v.15 no.8 Ti-Si-N Diffusion Barriers between Silicon and Copper J. S. Reid;X. Sun;E. Kolawa;M. A. Nicolet https://doi.org/10.1109/55.296222
- J. Appl. Phys. v.81 Reactively Sputtered Ti-Si-N Films. II. Diffusion Barriers for Al and Cu Metallizations on Si X. Sun;J. S. Reid;E. Kolawa;M. A. Nicolet;M. R. P. Ruiz https://doi.org/10.1063/1.364206
- J. Appl. Phys. v.81 no.9 Structural Investigation of Thermally Nitrided Amorphous Ti Silicide Y. Miura;S. Fujieda https://doi.org/10.1063/1.364432
- Appl. Phys. Lett. v.70 no.23 Chemical Vapor Deposition of Titaniumsiliconnitride Films P. M. Smith;J. S. Custer https://doi.org/10.1063/1.119108
- Solid-State Electronics v.45 no.12 Enhancement of Cu Nucleation in Cu-MOCVD by Pd Sputtering Pretreatment J. M. Lim;C. M. Lee https://doi.org/10.1016/S0038-1101(01)00192-7