Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Evaluation of Flaws in Adhesively Bonded Joint using Ultrasonic Signal Analysis

초음파 신호분석을 이용한 접착접합 이음의 결함평가

  • Hwang, Yeong-Taik (Dept. of Precision Mechanical Engineering, Samcheok National University) ;
  • Oh, Seung-Kyu (Safety System R&D Dept. Hyundai Mobis) ;
  • Han, Jun-Young (Dept. of Automation of Industrial Installation, Incheon Polytechnic College) ;
  • Jang, Chul-Sup (Dept. of Industrial Installation, Seoul Information Polytechnic College) ;
  • Yun, Song-Nam (Dept. of Mechanical Engineering, SoongSil University Graduate) ;
  • Yi, Won (Dept. of Mechanical Engineering, SoongSil University) ;
  • Kim, Hwan-Tae (Korea Institute of Science and Technology Information)
  • 황영택 (삼척대학교 정밀기계공학과) ;
  • 오승규 (현대모비스 안전시스템부) ;
  • 한준영 (인천기능대 산업설비자동화과) ;
  • 장철섭 (서울정보기능대 산업설비과) ;
  • 윤송남 (숭실대학교 기계공학과 대학원) ;
  • 이원 (숭실대학교 기계공학과) ;
  • 김환태 (한국과학기술정보연구원)
  • Published : 2004.04.01
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Abstract

Ultrasonic signals transmitted through adhesively bonded plates were used to evaluate parameters related to attenuation and frequency in the adhesively bonded joint. The kinds of bonding materials with a different bonding thickness of constant pressure were used. And ultrasonic diagnosis was evaluated by p-wave sensor of 10MHz. FFT has been performed to determine bond-layer parameters such as effective thickness and frequency for adhesively bonded joint of A16061 plates in comparison with measured to theoretical ratios. When variable thickness exists, the ultrasonic spectrum was changed the frequency wave. The more materials thickness and the higher the frequency, the larger shift was observed. Measured ratios for cases of bond thickness and variety bonding materials are then used to determine bond parameters. The results show that the technique can be applied to the characterization of adhesively bonded joint.

Keywords

References

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