TiO2 박막의 증착거동에 미치는 스퍼터링 공정변수의 영향

Effect of Sputtering Parameter on the Deposition Behavior of TiO2 Thin Film

  • Kim, Eul-Soo (Dept. of Metallurgical & Materials Engineering, Gyeongsang National University) ;
  • Lee, Gun-Hwan (Dept. of Metallurgical & Materials Engineering, Gyeongsang National University) ;
  • Kwon, Sik-Chol (Dept. of Metallurgical & Materials Engineering, Gyeongsang National University) ;
  • Ahn, Hyo-Jun (Korea Institute of Machinery & Materials)
  • 발행 : 2003.03.15

초록

$TiO_2$ thin films were deposited by DC reactive magnetron sputtering with variations in sputtering parameter such as Ar and $O_2$ flow rate, DC power, substrate temperature and magnetic field. Deposition rate, crystal structure, chemical bond of $TiO_2$ films on the deposition conditions were investigated by Alpha-step, X-ray Diffractometer(XRD), X-ray Photoelectron Spectroscopy(XPS). When the DC power was applied at 500watt, deposition rate of $TiO_2$ film was about 480A/min. $TiO_2$ films coated under the deposition condition of 15sccm Ar and 7~10sccm $O_2$ flow rate was only observed anatase phase. With increasing substrate temperature from RT to $300^{\circ}C$, crystal orientation of $TiO_2$ films variously became.

키워드

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