몰딩공정을 응용한 플립칩 언더필 연구

Studies on Flip Chip Underfill Process by using Molding System

  • 한세진 ;
  • 정철화 (한국기술교육대학교 전자공학과) ;
  • 차재원 (한국기술교육대학교 기계공학과) ;
  • 서화일 (한국기술교육대학교 전자공학과) ;
  • 김광선 (한국기술교육대학교 기계공학과)
  • 발행 : 2002.08.01

초록

In the flip-chip process, the problem like electric defect or fatigue crack caused by the difference of CTE, between chip and substrate board had occurred. Underfill of flip chip to overcome this defects is noticed as important work developing in whole reliability of chip by protecting the chip against the external shock. In this paper, we introduce the underfill methods using mold and plunge and improvement of process and reliability, and the advantage which can be taken from embodiment of device.

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