Hot Plate 신뢰성 시험.평가시스템 개발

Reliability Evaluation System of Hot Plate for Photoresist Baking

  • 송준엽 (한국기계연구원 지능형정밀기계연구부) ;
  • 송창규 (한국기계연구원 지능형정밀기계연구부) ;
  • 노승국 (한국기계연구원 지능형정밀기계연구부) ;
  • 박화영 (한국기계연구원 지능형정밀기계연구부)
  • Song, Jun-Yeop (Intelligence Precision Mechanical Research Center, Korea Institute of Machinery and Materials) ;
  • Song, Chang-Gyu (Intelligence Precision Mechanical Research Center, Korea Institute of Machinery and Materials) ;
  • No, Seung-Guk (Intelligence Precision Mechanical Research Center, Korea Institute of Machinery and Materials) ;
  • Park, Hwa-Yeong (Intelligence Precision Mechanical Research Center, Korea Institute of Machinery and Materials)
  • 발행 : 2002.08.01

초록

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist (PR) and to bake coated PR in FAB process of semiconductor. The badness of Hot Plate (HP) has directly influence upon the performance of wafer, it is necessary to guarantee the performance of HP. In this study, a reliability evaluation system has been designed and developed, which is to measure and to estimate thermal uniformity and flatness of HP in range of temperature 0~$250^\circC$. This system has included the techniques which measures and analyzes thermal uniformity using infrared thermal vision, and which compensates measuring error of flatness using laser displacement sensor For measuring flatness, a measurement stage of 3 axes are developed which adapts the precision encoder. The allowable error of this system in respect of thermal uniformity is less $than\pm0.1^\circC$ and in respect of flatness is less $than\pm$1mm . It is expected that the developed system can measure from $\Phi200mm\;(wafer 8")\;to\;\Phi300mm$ (wafer 12") and also can be used in performance test of the Cool Plate and industrial heater, etc.

키워드

참고문헌

  1. 前田和夫(임종성 譯), '반도체 제조장치 입문,' 성안당, 2000
  2. '반도체-공정 및 측정,', 전자자료, 1986
  3. 安食桓雄, 松下電子(주), '半導體デパイスの信賴性技術,' 日科技連, 1998
  4. 日本信賴性學會, '21世紀ヘの技術-信賴性ハンドブツク,' 日科技連, 1997
  5. Internation Standard, ISO 230-1:1996(E) second edition
  6. Thermal-Track RTD System - Wafer Sensor Manual, SensArray Corp., 2000. 8
  7. Thermal Vision LAIRD-S270 Operation Manual, Nikon, 2000
  8. 박화영 외, '반도체 장비 핵심부품의 종합 신뢰성 평가시스템 개발,' 한국기계연구원, 2000. 12
  9. 송준엽, 송창규, 노승국, 박화영, 'Hot Plate 신뢰성 시험·평가장비 개발,' 한국정밀공학회 춘계학술대회 논문집, pp. 566-569, 2001
  10. 김승우, '기하공차의 평가를 위한 형상추출 알고리즘,' 대한기계학회지, 통권160, pp. 177-184, 1994
  11. 박문진, 김강, '가공경로가 밀링가공면의 기하학적 특성에 미치는 영향,' 한국정밀공학회지, 제15권, 제6호, pp. 58-63, 1998