전자부품 패키징 경향 및 접합부 형상과 특성평가

Trends of Electronic Packaging and Characteristics Evaluation by Shape of Solder Joints

  • 신영의 (중앙대학교 기계공학부) ;
  • 고영욱 (중앙대학교 기계공학부) ;
  • 김종민 (오사카대학 공학연구과 생산과학) ;
  • 윤종구 (산업자원부 기술표준원 전자표준과)
  • 발행 : 2002.06.01

초록

키워드

참고문헌

  1. IEEE Proceedings of the 49th Electronic Components & Technology Conference Estimate the Thermomechanical Fatigue Life of Two Chip Scale Packages Q.Yao;J.Qu;S.X.Wu
  2. Microelectronics & Reliability v.39 Characterization of Chip Scale Packaging Materials M.Amagai https://doi.org/10.1016/S0026-2714(99)00059-1
  3. Transactions of the ASME v.121 Three-Dimensional Versus Two Dimensional Finite Element Modeling of Flip-Chip Packages Q.Yao;J.Qu
  4. IEEE Transactions on Advanced Packaging v.24-2 An Overview of Solder Bump Shape Prediction Algorithms with Validations Kuo-Ning Chiang;Chang-An Yaun
  5. Filp Chip Technologies John H. Lau
  6. IEEE, 2000 Inter Sodiety Conference on Thermal Phenomena Shape prediction and Resicual Stress Evaluation of BGA and Flip Chip Solder Joints Hidehisa Sakai;Nobuyoshi Yamaoka;Kazuyuki Ujiie;Masanori Motegi
  7. Journal of LG Production Engineering v.3-5 Solder Joint Similarities between BGA/CSP and Other Surface Mount Devices Thomas W. Edwards
  8. Journal of KWS v.17-1 A Study on the Life Prediction and Quality Improvement of Solder Joint in IC Package Y.E.Shin;J.M.Kim
  9. Transactions of the ASME v.76 A Study of the Effect of Cyclic Thermal Stress on a Ductile Metal Coffin,L.F.Jr;Schenectady.N.Y.
  10. IEEE Transactions on Components, Hybrids and Manufacturing Technology v.CHMT-6 no.3 Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling Engelmeier,W.
  11. Microelectronics & Reliability v.40 Solder Joint Fatigue Models : review and applicability to chip scale package W.W.Lee;L.T.Nguyen;G.S.Selvaduray https://doi.org/10.1016/S0026-2714(99)00061-X
  12. Microjoining and Assembly Technology in Electronics v.98 Effect of strain Rate, Hold Time and Third Element on the Fatigue Damage of Sn-3.5mass%Ag Alloy Y.Kariya;H.Kagawa;M.Otsuka
  13. Acta Metall,Apr, K.N.Tu